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LandNavigator - SMD metal mask design support software

LandNavigator_top

"Land Navigator" is the Land, the optimal shape of a mask, and the simulation software of a Size which carry the past abundant mounting track record datas by Panasonic Factory Solutions.

Reliable result can be checked by calculating fillet volume automatically from a Lead Style in an instant.

Technical paper (japanese only)

Technical_paper.pdf

sales contact

LandNavigator_catalog.pdf


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FAQ

LandNavigator - SMD metal mask design support software

QAbout a hardware requirement
A

  1. Hardware requirement of recommendation
    CPU： More than 1GHz (recommendation)
    Memory：More than 1GB (recommendation)

    OS： Windows 2000 / Windows XP / Windows Vista / Windows 7


QAbout a license form
A

It is a node lock license.

A license Fixed is carried out at the installed specification terminal.

A license is distributed by a hardware key.


QAbout a maintenance contract.
A

Maintenance contract is not in this software.


QIs the quantity of the flux under solder paste taken into consideration? 
Ingredient of solder?
A

  2. Flux content can be specified.
  3. System recommendation Value is 50%.
  4. Moreover, it is basing on the evaluation result in 63Sn37Pb composition.

QAbout Lead-free solder alloy
A

  2. Lead-free solder alloy is weak compared with entering a lead.
  3. Therefore, consideration is required for fillet volume or a Style.

QAbout the proper Value of a side fillet.
About a proper quantity of reliability.
A

  1. At the time of the determination of a fillet style, rationalization processing is performed to the front unit or the side unit.
  2. Proper quantity is checking that there is no fall of junction intensity by the temperature cycle test at the time of mounting in a 1.6mm(thick) FR-4 board with 63Sn37Pb solder.(Requirementses  80/-40 ℃ 30 minutes each)

QCan the fillet style after a Reflow be seen with a viewer?
A

  1. It cannot see.

QIs the ground of a circiuit boads taken into consideration?
A

  2. It is not taking into consideration.
  3. Although based on the evaluation result in a pre-flux processing+ copper board, there is also an application track record to a solder leveller board.
  4. (1608 chips, 0.5mmQFP, etc.)

QIs the weight of the parts by the first reflow and the second feflow taken into consideration?
A

  2. It does not take into consideration.
  3. Since a Reflow profile, the calorific capacity of a substrate, etc. are related, this problem thinks that consideration is very difficult.

QIs the simulation in consideration of an offset of the Land and the metal mask possible?
A

  2. Simulation is impossible.
  3. This design specification is determined based on the result of having evaluated 150x220mm Size board by the printing machine with a Printing accuracy of 50 micrometers.

QDetermination of fillet volume is determined by the Height (thickness) of an electrode. 
Is the Parts Length taken into consideration
(if Parts excel, the heat stress concerning a soldering Top is strong)?  
A

  1. Not respond.

QWhich should the Input of a Parts Size just input?(Ave/Max/Min)
A

  1. Please input average value in principle.
  2. Ask a parts supplier, when average value is not indicated.

QDoes a squeegee also affect the amount of solder in addition to the thickness of a metal mask?
A

  1. It is affected.
  2. Recommendation is the rubber hardness of 90 degrees, and 60 degrees of attack squares low mark pressure squeegee requirementses.

QOn what is it based with the junction reliability of the proper fillet?
A

  1. It is considered as the fillet volume used as +- 10% or less of strengthening change of a heat 200 cycles test.(Requirementses  80/-40 ℃ 30 minutes each)

QWhat kind of thing is there in the inspection method in a Design specification?
A

  2. 3 kind correspondence.
  3.   Visual check
  4.   In circuit test (ICT)
  5.   Visual checker (VC)

QAbout Flow soldering
A

  1. Not correspond.
  2. Only reflow soldering.

QCan a User characteristic value be set to a parameter?
A

  2. It is possible.
  3. Setup specification can be changed although a recommendation value is displayed by default.

QAbout half etching correspondence
A

  2. It is possible.
  3. Setup specification can be changed although a recommendation value is displayed by default.

QCan the accuracy of a mounting machine be set up?
A

  1. The following mounting machine accuracy is the requisite and it cannot specify mounting accuracy as a parameter.

    +- 50 or less micrometers of printing machine accuracy, +- 100 or less micrometers of loading machine accuracy.

    However, specification of a User characteristic value is possible by change of a printing clearance or land width.

・Printing accuracy is bad
　Printing clearance is changed more greatly.
・Loading accuracy is bad
　Land width is changed more greatly.

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